LTCC and HTCC Market: Trends, Ceramic Technologies, and Advanced Circuit Integration

LTCC and HTCC Market Growth Report@ https://www.psmarketresearch.c....om/market-analysis/l

With the growth and usage of power devices, particularly 3rd-generation semiconductors, semiconductor devices are progressively evolving in the path of miniaturization, high power, multi-function, and integration, which also put forward greater needs on the performance of packaging substrates.

Ceramic substrates possess good heat resistance, high thermal conductivity, low coefficient of thermal expansion, radiation resistance, good insulation, high mechanical strength, corrosion resistance, and more, and are extensively employed in electronic device packaging.

Between them, co-fired multi-layer ceramic substrates are increasingly being employed in packaging high-power devices as they can attain a high degree of incorporation by firing electrode materials, electronic devices, and substrates at once. Co-firing multi-layer ceramic substrates are produced of various single ceramic substrates via methods such as hot pressing, lamination, sintering, and debinding.